Cleaning method after curing of thermal conductive silica gel

The main function of using thermal conductive silica gel on electronic products is to fill the gap between the contact surfaces and squeeze air out of the contact surfaces, so as to reduce the contact thermal resistance between the heat source surface and the contact surface of the radiator. After the thermal conductive silica gel is applied to the heat dissipation components, after many times of heat absorption and heat release, the bonding with the contact surface of the heat dissipation components will become stronger and stronger. Then, when re sizing or recycling components, how can the solidified heat conductive adhesive be disassembled without causing major damage to components?

1. Mechanical method: impact or percussion can be used to remove the glue. This method is simple and practical, but it is not recommended, because mechanical removal will cause different damages to the cooling components;

2. Heating method: heat the adhesive joint to the upper limit tolerance temperature of Huiju adhesive thermal conductive silica gel or higher. After a certain period of time, the silica gel adhesive will carbonize and become invalid. This method is also applicable to anaerobic and epoxy thermal conductive adhesives.

3. Dissolution method: For example, phosphate inorganic glue can be dissolved with ammonia, silicate inorganic glue can be dissolved with water, phenolic acetal glue can be dissolved with concentrated caustic soda water, etc.

These three methods are summarized according to the physical characteristics of thermal conductive silica gel itself. In general, there are certain damages to electronic components, so a good way is to select suitable thermal conductive materials during the initial construction to avoid secondary sizing.