In the production and processing of electronic products, the potting technology is often used.

So-called potting is liquid glue with mechanical or manual approach within the device is equipped with electronic components, circuit, and under the condition of normal temperature or heating, the glue become excellent curing process of thermosetting polymer elastomer, waterproof, moisture-proof, dustproof, corrosion resistance, heat resistance, insulation, thermal conductivity and confidential, the action of earthquake. These used for electronic components and circuit potting glue, known as electronic potting glue.

In terms of composition, electronic potting adhesive mainly consists of two parts, one is the organic silicone rubber body, the other is a functional filler. Silicone rubber is the main part of electronic potting glue, which is the framework of electronic potting glue. Functional fillers give electronic potting adhesive special properties, such as thermal conductivity, electrical conductivity, magnetic conductivity, flame retardant, etc., in thermal flame retardant electronic potting adhesive, mainly add flame retardant, thermal filler.

According to the different reaction mechanism of silicone rubber, silicone electronic potting adhesive can be divided into condensed silicone electronic potting adhesive and molding silicone electronic potting adhesive. Composition and characteristics of silicone electronic potting glue:

Condensation type silicone electronic pogging glue, 107 silicone rubber (α, ω -dihydroxyl polydimethylsiloxane) as the main body, with methyl trimethoxysilane, dimethyl diethoxysilane, γ -aminopropyl triethoxysilane, ethyl orthosilicate and other silane coupling agent as crosslinking agent, dibutyltin dillaurate as catalyst.

Characteristics: Volatile low molecular substances will be produced in the curing process, and the shrinkage rate is obvious after curing.

Add molding silicone electronic potting glue, with vinyl silicone oil as the main body, hydrogen silicone oil as crosslinking agent, Karstedt reagent as catalyst, with viscosing agent and inhibitor and other components.

Features: No small molecules are produced in the curing process, and the shrinkage rate is small.

Types and characteristics of functional filler:

Flame retardant and thermal conductive filler: silicone electronic potting adhesive with thermal conductivity and flame retardant function. The commonly used functional filler is mainly thermal conductive filler and flame retardant filler. There are many kinds of commonly used thermal and flame retardant fillers. At present, the mainstream thermal conductive filler is alumina, and the flame retardant filler is magnesium hydroxide.

Features: These fillers have excellent thermal conductivity, flame retardant performance, and small particle size, easy to disperse evenly in the silicone system.

Preparation method of silicone electronic potting glue:

Type mixer part condensation silicone electronic potting glue, usually within the vacuum kneading machine, will be A percentage of 107 silicone rubber, aluminum oxide, magnesium hydroxide, such as functional filler mixed at certain temperatures for A period of time, then add A certain amount of adjust the viscosity of vinyl silicone oil, with high speed shearing dispersion machine mixing time, part A, Stir the remaining crosslinking agent, catalyst and other components according to a certain amount to make component B.

The two components of silicone electronic potting glue are formed by fully mixing A certain amount of vinyl silicone oil, platinum catalyst and functional filler in the vacuum kneader to make component A, and mixing vinyl silicone oil, hydrogen silicone oil, functional filler, inhibitor and viscosing agent evenly in the vacuum kneader to make component B.