Frontier Applications and Technological Breakthroughs of Silicone Rubber in the Heat Dissipation Field of High-End Electronic Devices

In the field of high-end electronic devices, with the continuous improvement of chip computing speed and the continuous increase in device integration, the heat dissipation problem has become a key factor restricting their performance and reliability. With its unique performance advantages, silicone rubber has shown excellent application prospects in this field and has promoted a series of technological breakthroughs.
Silicone rubber has good thermal conductivity, and through special formulation design and filling technology, its thermal conductivity can be further significantly improved. In the heat dissipation modules of high-end computer CPUs, silicone rubber-based heat dissipation pads are widely used. These pads can closely fit the CPU and the heat sink. By utilizing the good thermal conductivity of silicone rubber, a large amount of heat generated by the CPU can be quickly transferred to the heat sink, and then the heat is dissipated through heat dissipation devices such as fans. Compared with traditional heat dissipation materials, silicone rubber pads have better flexibility and adaptability. They can perfectly fill the tiny gaps between the CPU and the heat sink, avoiding the increase in thermal resistance caused by poor contact, and effectively improving the heat dissipation efficiency.
Silicone rubber also plays an important role in smartphones. As the functions of mobile phones become more and more powerful, the internal space becomes more compact, and the difficulty of heat dissipation increases. Silicone rubber heat dissipation materials can be made into heat dissipation coatings and evenly coated on the surfaces of heat-generating components such as the motherboard of the mobile phone. This coating can not only conduct heat efficiently but also has certain insulation properties to prevent circuit short circuits. At the same time, the high and low temperature resistance of silicone rubber ensures that during the long-term use of the mobile phone, even in the face of large temperature fluctuations, it can still stably maintain the heat dissipation effect and ensure the stable performance of the mobile phone.
In order to further enhance the performance of silicone rubber in the heat dissipation field of high-end electronic devices, researchers are constantly exploring technological breakthroughs. On the one hand, new high thermal conductivity fillers such as boron nitride nanosheets and carbon nanotube arrays are developed, and the dispersion technology of these fillers in the silicone rubber matrix is optimized to achieve the construction of more efficient heat conduction paths. On the other hand, by precisely controlling the molecular structure of silicone rubber, the interaction between molecular chains is enhanced, and the thermal stability and mechanical properties of the material are improved, enabling it to maintain good heat dissipation performance when subjected to complex stresses and temperature changes inside electronic devices. For example, by introducing special cross-linking agents, a stable and uniform cross-linking network is formed, effectively increasing the thermal deformation temperature of silicone rubber and ensuring that the heat dissipation material will not soften or deform in a high-temperature environment, affecting the heat dissipation effect.


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