Heat dissipation mode of thermal conductive silicon film

Heat dissipation method of thermal conductive silicon film case This method uses the metal case of notebook to dissipate heat. At present, the commonly used aluminum-magnesium alloy shell uses graphite heat sink to conduct heat, and the heat dissipation is quite good. Compared with the traditional plastic shell, it greatly improves the overall heat dissipation performance of the notebook. Another advantage of this design is that it reduces the power consumption and noise caused by unnecessary fan operation, making the system more stable and longer standby time.

Heat dissipation mode of keyboard There is a heat dissipation aluminum plate at the bottom of the keyboard, on which a special layer of silica gel is placed. This aluminum plate contacts with the heat dissipation aluminum plate on the notebook main board, so that the heat of the heat dissipation plate on the main board is transferred to the bottom of the keyboard. Many "vent holes" are densely distributed on the aluminum plate for heat dissipation, and heat is discharged into the air through these holes. Which brand of thermal conductive silicon film is the best? You need to choose according to the actual situation.

Heat dissipation through cooling holes is a common way of heat dissipation, which is still used in many laptops. The cooling holes are generally designed around and at the bottom of the machine, so that internal heat can be removed from these holes. Some precautions also adopt some special air duct diversion design, using the location of the cooling holes and the internal structure layout to form a better air circulation environment.

External heat dissipation This heat dissipation method is to strengthen the later heat dissipation, using third-party heat dissipation products, such as heat dissipation base and other equipment, with built-in silicon film.

The manufacturer of thermal conductive silicone sheet tells you that the density of thermal conductive grease is different with different thermal conductivity of thermal conductive silicone sheet. According to the actual situation, the thermal conductivity is selected to determine the extrusion weight. After extrusion, the hot grease will solidify within 20 minutes. After curing, its performance is similar to that of thermal conductive silicon film, and the radiator and heating chip are easily separated. The disadvantage is that it can only be assembled and used once, and cannot be repeatedly assembled and maintained.