How to Choose Thermal Conductive Silicone Sheet

Usually, before selecting thermal conductive silicone sheets, considerations should be given to electronic product structure, thermal conductivity, scale, thickness, thermal resistance, and expected effects.

Precautions for selecting thermal conductive silicone material:

1. Selection of product structure design: In the early stage of electronic product structure design, thermal conductive silicon film should be considered to be integrated into the design problem. Under different requirements and usage environments, the heat dissipation scheme is different, and the optimal heat dissipation scheme should be selected based on the actual situation. A reasonable heat dissipation structure should be designed to maximize the effect of thermal conductive silicon film.

Thermal conductive silicone sheet

2. The selection of thermal conductivity of thermal conductive silicon film depends on the expected effect, the power consumption of the heat source, and the amount of heat that can be dissipated by the design of the heat sink or heat dissipation structure. Select the thermal conductivity of thermal conductive silicon film based on these requirements. The cost of low thermal conductivity is relatively low, while those with high thermal conductivity have good results and higher costs.

3. The selection of the thickness of thermal conductive silicone film should consider the heat dissipation scheme used in the electronic product itself. If choosing a heat dissipation structure, it is necessary to consider the shape and structure of the heat dissipation structure on the contact surface, and strike a balance between the design structure and the thickness selection of thermal conductive silicone film. The selection of thickness is also related to parameters such as hardness, density, and compression ratio of the product.

4. The best way to choose the size of thermal conductive silicon film is to cover the heat source. The breakdown voltage, resistance, surface resistivity, etc. meet the conditions.How to Choose Thermal Conductive Silicone Sheet

Usually, before selecting thermal conductive silicone sheets, considerations should be given to electronic product structure, thermal conductivity, scale, thickness, thermal resistance, and expected effects.

Precautions for selecting thermal conductive silicone material:

1. Selection of product structure design: In the early stage of electronic product structure design, thermal conductive silicon film should be considered to be integrated into the design problem. Under different requirements and usage environments, the heat dissipation scheme is different, and the optimal heat dissipation scheme should be selected based on the actual situation. A reasonable heat dissipation structure should be designed to maximize the effect of thermal conductive silicon film.

Thermal conductive silicone sheet

2. The selection of thermal conductivity of thermal conductive silicon film depends on the expected effect, the power consumption of the heat source, and the amount of heat that can be dissipated by the design of the heat sink or heat dissipation structure. Select the thermal conductivity of thermal conductive silicon film based on these requirements. The cost of low thermal conductivity is relatively low, while those with high thermal conductivity have good results and higher costs.

3. The selection of the thickness of thermal conductive silicone film should consider the heat dissipation scheme used in the electronic product itself. If choosing a heat dissipation structure, it is necessary to consider the shape and structure of the heat dissipation structure on the contact surface, and strike a balance between the design structure and the thickness selection of thermal conductive silicone film. The selection of thickness is also related to parameters such as hardness, density, and compression ratio of the product.

4. The best way to choose the size of thermal conductive silicon film is to cover the heat source. The breakdown voltage, resistance, surface resistivity, etc. meet the conditions.