Matters to be noted in the injection molding of hardware packaging adhesive

1. The compatibility between TPE and hard adhesive structural components needs to be matched, and the molecular solubility is close to each other in order to achieve better molecular compatibility;

2. In the design, it is necessary to avoid sharp corners as much as possible to ensure excellent contact between TPE and hard adhesive parts and improve the bonding effect;

3. Avoid gas retention in the mold cavity through appropriate exhaust;

4. Maintain the temperature of TPE melt to ensure bonding effect;

5. Balance the thickness of TPE with the expected tactile sensation;

6. TPE material encapsulation requires drying and reprocessing to reduce surface water marks and achieve uniform surface color;

7. The selected color masterbatch has a carrier resin that is compatible with TPE and structural component materials;

8. For smooth surfaces, special treatment is required to increase the bonding contact surface between soft and hard adhesives and enhance the bonding effect;

9. TPE should have good fluidity, as the thickness to size ratio of the hardware packaging adhesive layer is very small, TPE usually needs to flow through a longer path and thin-walled area to fill the mold;

10. The flow length/product thickness ratio of TPE is less than 150:1.